Interflux® DP 5505 solder paste is a low voiding solder paste. These solder pastes will, under the same conditions, show far fewer voids than standard solder pastes. Solder pastes can be specially designed and formulated to reduce outgassing. Depending on the type of solder paste, this method has more or less effect. This allows the outgassing solder flux to escape without immediately becoming trapped in the liquid tin. A zone of constant temperature is then created below the melting temperature of the solder. The voiding can be avoided by adjusting the temperature profile. To reduce this problem, there are reflow ovens and vapour phase reflow systems on the market that generate a negative pressure or vacuum during the liquid phase, which ‘sucks’ the gas bubbles out. Especially in places under components it is extra difficult for the gases to escape because gases tend to move vertically.
When these gas bubbles have not left the liquid tin they become trapped in the solidified mass during the solidification of the solder. The flux contains resins and solvents, among other things, which all gas out when heated. Reflow This is the stage where the temperature within the reflow oven is increased above the melting point of the solder paste causing it to form a liquid. Solder paste consists of 2 main components, namely metal powder and flux. However, the main cause of these voids, which are in fact gas bubbles, is the solder paste used. The cause of this phenomenon can be found in the outgassing of substances used in the various components, materials and PCBs. What is voiding and does the reflow profile affect it? VoidingĪ phenomenon that occurs in the reflow soldering process.īubbles (voids) begin to form in the flowed and solidified solder which make the solder joint hollow to a certain extent.
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